Tektronix Innovation Forum 2018

Tektronix Innovation Forum 2018

Technology is advancing at the speed of light.

Every day, engineers are pressed by the latest technology advancements, innovative applications deployment. With shrinking resources and shortened time-to-market, keeping abreast will never be easy.

Join TIF 2018 as we share test and measurement insights to break through the walls of complexity, and accelerate growth. You will be empowered to create and realize technological advances with greater ease, speed and accuracy.

Applications

Power Efficiency

Connected Car

Wired Communication

Wireless and RF

Venue & Program

Date: May 3, 2018 (Thursday)

Venue: Ballroom 2, LG Level - Main Wing
Equatorial Hotel, Penang

Time: 9:00am - 5.30pm
Registration starts at 8.30am

Address: 1 Jalan Bukit Jambul, 11900 George Town, Penang, Malaysia
Location Map

Time Description / Topic
8.30am – 9.00am Registration
9.00am – 9.15am Opening Address
9.15am – 10.10am Topic 1: Simplifying EMC Pre-Compliance and Troubleshooting of IoT Designs

More on the topic »

Failing EMI/EMC Testing at late in the design cycle is costly but can be avoided. Performing pre-compliance test greatly improves the probability of passing a full EMI/EMC compliance test.

In this session, we will show you tips on how to setup and measure common IoT wireless standards and also how to conduct EMC Pre-Compliance test. We will also show how a time-correlated Cross-Domain approach can help you identify sources of EMI interference.

10.10am – 10.40am Tea-Break with Solutions Booth Visit
10.40am - 11.30am Topic 2: Enhanced Bench, Lab and Production Test with New Instruments and Software Solutions

More on the topic »

Are your bench instruments giving you “more”, or just providing the same functions and features they always have?

This session will address the issue of bench instrument usability and discuss some of things that you should expect as you modernize your work space. We will review new features/tools to enhance some of your common measurements.

11.30am – 12.30pm Topic 3: Precise Wide Bandgap Devices and Systems Characterization and Measurement Made Easy

More on the topic »

For the past 50 years, Silicon (Si) has dominated the power electronics world. In recent years, it has become an increasing challenge to create new devices with greater power density and energy efficiency using Silicon.

Wide bandgap materials like Silicon Carbide (SiC) and Gallium Nitride (GaN) are showing superior material properties. This allow higher performance compared to the current Silicon technology.

Learn about wide bandgap semiconductors theory and their applications. We will also show how you can precisely test and characterize them at Device, Circuit and System levels.

12.30pm – 2.00pm Lunch with Solutions Booth Visit
2.00pm - 3.00pm Topic 4: Physical Layer Testing of MIPI Mobile Devices

More on the topic »

Mobile Industry Processor Interface (MIPI) has gained more and more attention by many non-mobile phone designers. As mobile connectivity becomes increasingly pervasive in business and society, more industries are leveraging mobile technologies in their designs.This includes those working on autonomous driving systems, in-vehicle infotainment and many other IoT devices.

In this session, we will introduce MIPI standards such as D-PHY and M-PHY on their applications. Learn how to setup and perform verification and debug tests on the electrical PHY Layer for D-PHY and M-PHY serial interconnects.

3.00pm  - 3.30pm Tea-Break with Solutions Booth Visit
3.30pm  - 4.30pm Topic 5: Next Generation Automotive and Power Design Testing

More on the topic »

Advanced Driver Assistance Systems (ADAS), smart safety systems, and human to machine subsystems generate vast amounts of data to transport throughout a vehicle. Automotive Ethernet stems from proven IT technology and serves the needs for both capacity and integration.

In this session, understand automotive interconnect compliance testing, debug and characterize beyond compliance. We will discuss how to handle testing of parameters for standards such as 100/1000Base-T1.

4.30pm - 5.20pm Topic 6: Test and Debug PCIe Gen4 with Confidence

More on the topic »

With increasing requirements imposed by cloud-based computing power, storage capacity, and network bandwidth - the server/storage industry is rapidly progressing from PCIe Gen3 to Gen4 and in the future, Gen5. This rapid progression brings an entirely new set of test and measurement challenges for both base silicon testing and CEM compliance testing.

In this session, we will be sharing insights on on difference in test requirements between the various PCIe generations. We will also discuss the challenges in Transmitter (Tx), Receiver (Rx), Link Equalization (LEQ) and Phased Loop Lock (PLL) testing. Specifically, we point out challenges in PHY and protocol-aware testing. Debugging loop-back initiation and link-training will also be discuss by introducing a protocol-aware BER tester and oscilloscope.

5.30pm Closing and Lucky Draw

What to expect at TIF?

Live

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Presentation

Presentation by the expert

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Games and Lucky Draw

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