Spectrum View is a new way of performing spectrum analysis on an oscilloscope. The ADC in the oscilloscope sends high-speed digitized data down two paths. One path leads to hardware decimators which determine the rate at which time domain samples are stored. The second path leads to digital down-converters also implemented in hardware.

This approach enables independent control of the time domain and frequency domain acquisitions, allowing optimization of both waveform and spectrum views of a given signal. It also makes much more efficient use of the long but finite record length available in these instruments.

Timing jitter is the unwelcome companion of all electrical systems that use voltage transitions to represent timing information. Historically, electrical systems have lessened the ill effects of timing jitter (or, simply “jitter”) by employing relatively low signaling rates.

As signaling rates climb above 2 GHz and voltage swings shrink to conserve power, the timing jitter in a system becomes a significant percentage of the signaling interval. Under these circumstances, jitter becomes a fundamental performance limit.

When comparing past, present and future automobiles, one trend is clear: cars have become data centers on wheels. Within each vehicle, the volume of data from safety systems, onboard sensors, navigation systems, and so on—and the reliance on that data—continues to grow rapidly.

We anticipate automobiles will continue to utilize CAN, CAN-FD, LIN, FlexRay, SENT and MOST; however, the current top-end data rates are 10 Mbps with FlexRay and 150 Mbps with MOST. In automotive applications, optimal utilization of data requires faster throughput, lower latency, greater reliability, and higher quality of service (QoS) to ensure safe, reliable operation of the vehicle. With speeds that reach up to 10 Gbps, Automotive Ethernet will play a growing role in carrying high-speed data communications.

Being a full duplex communication on single UTP cable, to properly test Automotive Ethernet communication between ECUs engineers are forced to perform a Hardware decoupling and to “cut the wire” in order to control the communication flow, with consequences of accuracy degradation because of insertion losses and timing misalignment.

Tektronix proposes a patent pending solution for separating signals, PAM3 eye analysis and protocol decoding without breaking the link

Because of their high switching-speed capability, the characterization of fast switching converters strongly depends on appropriate measurements.

Double Pulse Test new layouts force reconsidering choices for scopes and probes to capture signals with high fidelity, minimizing parasitic inductanceand ground loops, using the right PCB connectors adapters, but mostly avoiding expensive time waste on ghost measurements artifacts

Ethernet has traditionally been the backbone of Enterprise IT and infrastructure of campus and data centres.

On the higher end applications, Ethernet has supported the Cloud Providers with 100 and 400G Ethernet standards and now service providers moving into the Tera bit speed.

On the other hand, lower speed applications like industrial automation and automotive is a new area where Ethernet is providing a great advantage in communication.

Previous generations of the PCI Express standard provided a significant ability to trade-off data and reference clock jitter at a platform level. Today the combination of 400G Ethernet, cloud AI and modeling (co-processors), storage capacity, and NAND-based storage are driving the adoption of PCI Express 5.0.

The result, however, is a diminished clock jitter budget and consequently a number of new validation and compliance challenges. This webinar presents an overview of reference clock jitter requirements as they have evolved and offers techniques for making these low femtosecond measurements using a real time oscilloscope.

Attend the webinar to learn about:

• The evolution of PCI Express reference clock specifications leading up to 5.0.
• Measurement techniques for reference clock high frequency jitter measurements
• Post-processing tool availability and correlation
• The latest developments for the 5.0 REFCLK compliance testing

The Tektronix Curve Tracer is one of the most successful instruments in history. It offers ease of use, as well as, an intuitive data presentation.

Decades have passed, yet, the Tektronix Curve Tracer continues to play an important role in the industry. This is especially true for failure analysis. This hero is now old. Due to the age of the instrument and spare parts shortages, it faced the difficulties of lasting for another 5 years.

A functional successor to Tektronix landmark curve tracers like the 576 and 370A, I-V Tracer with Keithley SourceMeter instruments offers the first modern alternative to those who love the direct control a curve tracer offers. Add a simple desktop solution rather than searching for overpriced repair parts or replacements for aging curve tracers.

Materials and semiconductor advances our world of electronics and high speed communication. Whether you are making Femtofarad capacitance measurements, Semiconductor and NVM reliability or C-V Measurement for high impedance applications, we all like to have an intuitive tool to deal with the complex world to innovate our world.

Let us introduce you to the world of the 4200A-SCS Parameter Analyzer, where we will review a range of applications in material, semiconductor and device characterization. Get parametric insights faster and clearer.

Accurately determining power consumption and efficiency doesn’t have to be difficult or time-consuming. Low current levels and the need for precision can seem daunting, but proper test design can give you more accurate results faster. And good use of software or simple programming can accelerate your work further.

In this webinar, we will review techniques for measuring power consumption of components and devices and discuss methods for measuring power efficiency of converters. You’ll come away with an understanding of:

• The best ways to measure power consumption of discrete devices
• Advances in measuring power efficiency of converters
• Techniques for automating these measurements

The proliferation of 3D sensing applications such as facial recognition, gesturing, augmented reality in both consumer and industrial applications is driving the increased production of optoelectronics devices like laser diodes.

This is especially true for the Vertical Cavity Surface Emitting Laser (VCSEL), which is one of the primary components used in these 3D sensing systems. To minimize device self-heating, testing of the VCSELs are generally performed using “pulsed” DC. However, requirements to test at current levels up to 10A is driving the need to use pulses as short as 10µs in order to maintain reasonable self-heating levels.